EPO-TEK H70E

EPO-TEK H70E


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Code : EPO-TEK H70E

Specification : 85G

Producer : Epoxy tecnology

EPO-TEK® H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. It is an excellent heat-sinking adhesive and is recommended for thermal management applications where good heat dissipation is needed. EPO-TEK® H70E exhibits excellent handling characteristics and an extremely long pot life at room temperature. Easy to use; can be screen printed, machine dispensed, stamped or hand applied. Excellent adhesion to ferrous and non-ferrous metals, glass, ceramic, kovar and PCB. Can be cured very rapidly.

Cure Schedule (minimum bond temperature/time)

  • 175ºC / 1 Minute
  • 150ºC / 5 Minutes
  • 120ºC / 15 Minutes
  • 80ºC / 90 Minutes

Properties (summary)

  • Color : Grey / Beige
  • Consistency: Slightly Pourable Paste
  • Viscosity: 4,000 – 7,000 cps
  • Thermal Conductivity: 0.9 W/mK
  • Operating Temperature: -55ºC to 200ºC (-67ºF to 392ºF)
  • Pot Life: 56 hours

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