EPO-TEK H70E
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Code : EPO-TEK H70E
Specification : 85G
Producer : Epoxy tecnology
EPO-TEK® H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. It is an excellent heat-sinking adhesive and is recommended for thermal management applications where good heat dissipation is needed. EPO-TEK® H70E exhibits excellent handling characteristics and an extremely long pot life at room temperature. Easy to use; can be screen printed, machine dispensed, stamped or hand applied. Excellent adhesion to ferrous and non-ferrous metals, glass, ceramic, kovar and PCB. Can be cured very rapidly.
Cure Schedule (minimum bond temperature/time)
- 175ºC / 1 Minute
- 150ºC / 5 Minutes
- 120ºC / 15 Minutes
- 80ºC / 90 Minutes
Properties (summary)
- Color : Grey / Beige
- Consistency: Slightly Pourable Paste
- Viscosity: 4,000 – 7,000 cps
- Thermal Conductivity: 0.9 W/mK
- Operating Temperature: -55ºC to 200ºC (-67ºF to 392ºF)
- Pot Life: 56 hours
HO CHI MINH HEAD OFFICE
(Please contact in advance to check inventory)
- No. 59/66 Vo Thi Thua, An Phu Dong Ward, Dist. 12, Ho Chi Minh City
- Tel: 0919.540.660
- Email:phuong.d@bma-vietnam.com
HANOI BRANCH OFFICE
(Please contact in advance to check inventory)
- No. 595/41 Linh Nam, Linh Nam Ward, Hoang Mai Dist., Hanoi City.
- Tel: 0389.949.316
- Email: cam.p@bma-vietnam.com
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